Stress induction in 3d device channel using elastic relaxation of high stress material

ABSTRACT

A method for inducing stress in a device channel includes forming a stress adjustment layer on a substrate, the stress adjustment layer including an as deposited stress due to crystal lattice differences with the substrate. A device channel layer is formed on the stress adjustment layer. Cuts are etched through the device channel layer and the stress adjustment layer to release the stress adjustment layer to induce stress in the device channel layer. Source/drain regions are formed adjacent to the device channel layer.

BACKGROUND Technical Field

The present invention generally relates to semiconductor devices, andmore particularly to substrates and methods for fabrication that yield acompressive strain employed for formation of semiconductor devices.

Description of the Related Art

As the device density increases, greater challenges for use oftraditional external stressors in channel materials exist. A relaxedSiGe buffer can be used to induce tensile stress in silicon but no clearequivalent solution for compressive stress exists. SiGe layers can bevery defective if above a critical thickness, implanted or subjected toa high thermal budget.

Strained silicon and strained silicon-on-insulator (SOI) can provideenhanced properties for semiconductor devices. For example, p-type fieldeffect transistors (PFETs) have improved performance when formed with acompressive strain channel, and n-type field effect transistors (NFETs)have improved performance when formed with a tensile strain channel.Tensile strain devices are easily formed using, e.g., relaxed SiGebuffer layers or SiGe condensation. Compressively strained silicon ismuch more difficult to achieve.

SUMMARY

In accordance with an embodiment of the present invention, a method forinducing stress in a device channel includes forming a stress adjustmentlayer on a substrate, the stress adjustment layer including an asdeposited stress due to crystal lattice differences with the substrate.A device channel layer is formed on the stress adjustment layer. Cutsare etched through the device channel layer and the stress adjustmentlayer to release the stress adjustment layer to induce stress in thedevice channel layer. Source/drain regions are formed adjacent to thedevice channel layer.

Another method for inducing stress in a device channel includes forminga stress adjustment layer on a substrate, the stress adjustment layerincluding an as deposited stress due to crystal lattice differences withthe substrate; forming a device channel layer on the stress adjustmentlayer; forming fins in the device channel layer on the stress adjustmentlayer; forming gate structures transversely over the fins; etching cutsthough the device channel layer and the stress adjustment layer on sidesof the gate structures to release the stress adjustment layer to inducestress in the device channel layer; and forming source/drain regionsadjacent to the device channel layer.

A semiconductor device having compressive stress in a device channelincludes a stress adjustment layer formed on a substrate. A devicechannel layer is formed on the stress adjustment layer. The devicechannel layer includes a compressive stress induced by stress relaxationof the stress adjustment layer, which includes tensile stress from an asdeposited stress provided from crystal lattice differences with thesubstrate. Source/drain regions are formed adjacent to the devicechannel layer.

These and other features and advantages will become apparent from thefollowing detailed description of illustrative embodiments thereof,which is to be read in connection with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The following description will provide details of preferred embodimentswith reference to the following figures wherein:

FIG. 1 is a cross-sectional view taken parallel to fins to be formedshowing a device channel layer and a stress adjustment layer formed on asubstrate in accordance with an embodiment of the present invention;

FIG. 2 is a cross-sectional view taken perpendicular to fins to beformed showing a device channel layer and a stress adjustment layerformed on a substrate in accordance with an embodiment of the presentinvention;

FIG. 3 is a cross-sectional view taken parallel to fins showing thedevice channel layer and the stress adjustment layer formed on thesubstrate in accordance with an embodiment of the present invention;

FIG. 4 is a cross-sectional view taken perpendicular to fins showing thefins etched into the device channel layer and the stress adjustmentlayer in accordance with an embodiment of the present invention;

FIG. 5 is a cross-sectional view taken parallel to fins showing dummygate structures formed over the fins in accordance with an embodiment ofthe present invention;

FIG. 6 is a schematic top view showing section lines for parallel andperpendicular fin views in accordance with an embodiment of the presentinvention;

FIG. 7 is a cross-sectional view taken parallel to fins showing cutsthrough the fins to release stress in the stress adjustment layer andinduce stress in the device channel layer in accordance with anembodiment of the present invention;

FIG. 8 is a cross-sectional view of FIG. 7 taken perpendicular to thefins in accordance with an embodiment of the present invention;

FIG. 9 is a cross-sectional view taken parallel to fins showing sourceand drain regions formed in accordance with an embodiment of the presentinvention;

FIG. 10 is a cross-sectional view of FIG. 9 taken perpendicular to thefins showing source and drain regions formed in accordance with anembodiment of the present invention;

FIG. 11 is a cross-sectional view taken parallel to fins to be formedshowing device channel layers and stress adjustment layers of ananosheet structure formed on a substrate in accordance with anembodiment of the present invention;

FIG. 12 is a cross-sectional view taken perpendicular to fins to beformed showing device channel layers and stress adjustment layers of thenanosheet structure formed on the substrate in accordance with anembodiment of the present invention;

FIG. 13 is a cross-sectional view taken parallel to fins showing thedevice channel layers and the stress adjustment layers of the nanosheetstructure formed on the substrate in accordance with an embodiment ofthe present invention;

FIG. 14 is a cross-sectional view taken perpendicular to fins showingthe fins etched through the device channel layers and the stressadjustment layers of the nanosheet structure in accordance with anembodiment of the present invention;

FIG. 15 is a cross-sectional view taken parallel to fins showing dummygate structures formed over the fins in accordance with an embodiment ofthe present invention;

FIG. 16 is a cross-sectional view taken parallel to fins showing cutsthrough the fins to release stress in the stress adjustment layers andinduce stress in the device channel layers in accordance with anembodiment of the present invention;

FIG. 17 is a cross-sectional view of FIG. 16 taken perpendicular to thefins in accordance with an embodiment of the present invention;

FIG. 18 is a cross-sectional view taken parallel to fins showing sourceand drain regions formed over a protection layer in accordance with anembodiment of the present invention;

FIG. 19 is a cross-sectional view of FIG. 18 taken perpendicular to thefins showing source and drain regions formed in accordance with anembodiment of the present invention;

FIG. 20 is a cross-sectional view taken parallel to fins showing etchback of stress adjustment layers and formation of dielectric materialfor protection in accordance with another embodiment of the presentinvention;

FIG. 21 is a cross-sectional view of FIG. 18 taken parallel to the finsshowing source and drain regions formed in accordance with an embodimentof the present invention;

FIG. 22 is a cross-sectional view taken parallel to fins showing adielectric fill formed and dummy gate materials exposed by planarizationin accordance with an embodiment of the present invention;

FIG. 23 is a cross-sectional view of FIG. 22 taken perpendicular to thefins showing the dielectric fill formed in accordance with an embodimentof the present invention;

FIG. 24 is a cross-sectional view taken parallel to fins showing thedummy gate and the stress adjustment layers selectively removed toexpose the device channel layers in accordance with an embodiment of thepresent invention;

FIG. 25 is a cross-sectional view of FIG. 24 taken perpendicular to thefins showing the dielectric fill formed in accordance with an embodimentof the present invention;

FIG. 26 is a cross-sectional view taken parallel to fins showing a gatestack formed in a void in accordance with an embodiment of the presentinvention; and

FIG. 27 is a cross-sectional view of FIG. 26 taken perpendicular to thefins showing the dielectric fill formed in accordance with an embodimentof the present invention.

DETAILED DESCRIPTION

In accordance with aspects of the present invention, methods andstructures are provided to form compressively strained structures. Insome embodiments, one or more semiconductor layers or fin structures arerendered compressive. In one example, compressive properties can beapplied to a semiconductor layer when a compound is inserted into alattice of the semiconductor material to alter a lattice constant of thesemiconductor material. The compound can include a material that is acrystalline compound and is preferably chemically bound with thematerial of the lattice. The compound can thus form a semiconductorcrystal within a semiconductor matrix and affect the lattice constant ofthe overall layer.

In one embodiment, a tensily strained layer can be formed on a substrateto induce tension in an adjacent layer (e.g., device channel). Thetensily strained layer may include Si₃P₄ on Si or SiC on Si, althoughother material combinations may be employed. The tensily strained layeris layered on the adjacent layer. The adjacent layer and the tensilystrained layer are etched to elastically release the tensily strainedlayer to induce a compressive strain into the adjacent layer. The etchedtensily strained layer and the adjacent layer can form a fin or form achannel region for another type of the field effect transistor (FET)device.

It is to be understood that aspects of the present invention will bedescribed in terms of a given illustrative architecture; however, otherarchitectures, structures, substrate materials and process features andsteps can be varied within the scope of aspects of the presentinvention.

It will also be understood that when an element such as a layer, regionor substrate is referred to as being “on” or “over” another element, itcan be directly on the other element or intervening elements can also bepresent. In contrast, when an element is referred to as being “directlyon” or “directly over” another element, there are no interveningelements present. It will also be understood that when an element isreferred to as being “connected” or “coupled” to another element, it canbe directly connected or coupled to the other element or interveningelements can be present. In contrast, when an element is referred to asbeing “directly connected” or “directly coupled” to another element,there are no intervening elements present.

The present embodiments can include a design for an integrated circuitchip, which can be created in a graphical computer programming language,and stored in a computer storage medium (such as a disk, tape, physicalhard drive, or virtual hard drive such as in a storage access network).If the designer does not fabricate chips or the photolithographic masksused to fabricate chips, the designer can transmit the resulting designby physical means (e.g., by providing a copy of the storage mediumstoring the design) or electronically (e.g., through the Internet) tosuch entities, directly or indirectly. The stored design is thenconverted into the appropriate format (e.g., GDSII) for the fabricationof photolithographic masks, which typically include multiple copies ofthe chip design in question that are to be formed on a wafer. Thephotolithographic masks are utilized to define areas of the wafer(and/or the layers thereon) to be etched or otherwise processed.

Methods as described herein can be used in the fabrication of integratedcircuit chips. The resulting integrated circuit chips can be distributedby the fabricator in raw wafer form (that is, as a single wafer that hasmultiple unpackaged chips), as a bare die, or in a packaged form. In thelatter case, the chip is mounted in a single chip package (such as aplastic carrier, with leads that are affixed to a motherboard or otherhigher level carrier) or in a multichip package (such as a ceramiccarrier that has either or both surface interconnections or buriedinterconnections). In any case, the chip is then integrated with otherchips, discrete circuit elements, and/or other signal processing devicesas part of either (a) an intermediate product, such as a motherboard, or(b) an end product. The end product can be any product that includesintegrated circuit chips, ranging from toys and other low-endapplications to advanced computer products having a display, a keyboardor other input device, and a central processor.

It should also be understood that material compounds will be describedin terms of listed elements. These compounds include differentproportions of the elements within the compound. In addition, otherelements can be included in the compound and still function inaccordance with the present principles. The compounds with additionalelements will be referred to herein as alloys.

Reference in the specification to “one embodiment” or “an embodiment”,as well as other variations thereof, means that a particular feature,structure, characteristic, and so forth described in connection with theembodiment is included in at least one embodiment. Thus, the appearancesof the phrase “in one embodiment” or “in an embodiment”, as well anyother variations, appearing in various places throughout thespecification are not necessarily all referring to the same embodiment.

It is to be appreciated that the use of any of the following “/”,“and/or”, and “at least one of”, for example, in the cases of “A/B”, “Aand/or B” and “at least one of A and B”, is intended to encompass theselection of the first listed option (A) only, or the selection of thesecond listed option (B) only, or the selection of both options (A andB). As a further example, in the cases of “A, B, and/or C” and “at leastone of A, B, and C”, such phrasing is intended to encompass theselection of the first listed option (A) only, or the selection of thesecond listed option (B) only, or the selection of the third listedoption (C) only, or the selection of the first and the second listedoptions (A and B) only, or the selection of the first and third listedoptions (A and C) only, or the selection of the second and third listedoptions (B and C) only, or the selection of all three options (A and Band C). This can be extended, as readily apparent by one of ordinaryskill in this and related arts, for as many items listed.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of exampleembodiments. As used herein, the singular forms “a,” “an” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprises,” “comprising,” “includes” and/or “including,” when usedherein, specify the presence of stated features, integers, steps,operations, elements and/or components, but do not preclude the presenceor addition of one or more other features, integers, steps, operations,elements, components and/or groups thereof.

Spatially relative terms, such as “beneath,” “below,” “lower,” “above,”“upper,” and the like, can be used herein for ease of description todescribe one element's or feature's relationship to another element(s)or feature(s) as illustrated in the FIGS. It will be understood that thespatially relative terms are intended to encompass differentorientations of the device in use or operation in addition to theorientation depicted in the FIGS. For example, if the device in theFIGS. is turned over, elements described as “below” or “beneath” otherelements or features would then be oriented “above” the other elementsor features. Thus, the term “below” can encompass both an orientation ofabove and below. The device can be otherwise oriented (rotated 90degrees or at other orientations), and the spatially relativedescriptors used herein can be interpreted accordingly. In addition, itwill also be understood that when a layer is referred to as being“between” two layers, it can be the only layer between the two layers,or one or more intervening layers can also be present.

It will be understood that, although the terms first, second, etc. canbe used herein to describe various elements, these elements should notbe limited by these terms. These terms are only used to distinguish oneelement from another element. Thus, a first element discussed belowcould be termed a second element without departing from the scope of thepresent concept.

Referring now to the drawings in which like numerals represent the sameor similar elements and initially to FIGS. 1 and 2, a substrate system10 is illustratively depicted in cross-section where the cross-sectionis taken parallel (\\) to the fins that will be formed. FIG. 2 shows thesubstrate system 10 illustratively depicted in cross-section where thecross-section is taken perpendicular (⊥) to the fins that will beformed.

The substrate system 10 includes a substrate 12 and a strain adjustmentlayer 14. The strain adjustment layer 14 is formed on the substrate 12and includes an as deposited material that includes a different out ofplane lattice parameter than the substrate 12. In particularly usefulembodiments, the strain adjustment layer 14 includes a tensilestress/strain to induce a compressive strain in an adjacent or nearlyadjacent device channel layer 16 as will be described. However, itshould be understood that the present embodiments can apply tocompressive materials to induce tensile stress/strains.

In one embodiment, the substrate 12 can include a silicon-basedmaterial, and, in particular, monocrystalline silicon (Si). Thesubstrate 12 is not limited to monocrystalline forms of Si as othermaterials and multi-layers thereof may be employed.

Strain adjustment layer 14 is preferably formed on the substrate 12 byepitaxial growth. In one embodiment, strain adjustment layer 14 includessilicon phosphide (Si₃P₄) or silicon carbide (SiC). The strainadjustment layer 14 can be formed without relaxation. In one embodiment,the Si₃P₄ can be employed and include a thickness of about 50 nm or morewhile maintaining its tensile properties. Pseudocubic Si₃P₄ is asemiconductor with narrow bandgap material that has a much smallerlattice (a) than silicon (a_(Si3P4)=4.961 angstroms versus a_(Si)=5.431angstroms). Si₃P₄ can be grown by epitaxy at low temperatures (e.g.,less than about 700 degrees C.). A very high stress can be achieved as ablanket deposited layer 14 (e.g., greater than 1.6 GPa can be achieved).

The strain adjustment layer 14 is deposited on the substrate 12 with asmaller out of plane lattice parameter to eventually result in theinducement of a compressive stress/strain in the device channel layer16. The device channel layer 16 is epitaxially grown on the strainadjustment layer 14, and can include the same material or a differentmaterial than the substrate 12. In one embodiment, the device channellayer 16 includes silicon (Si), silicon germanium (SiGe) or othercrystalline materials.

A hard mask 18 is formed on the device channel layer 16. The hard mask18 may include a nitride, such as, e.g., SiN, although other materialsor multilayers may be employed.

Referring to FIGS. 3 and 4, the cross-section of FIG. 3 is takenparallel (\\) to a fin 20, and the cross-section of FIG. 4 is takenperpendicular (⊥) to the fins 20 that will be formed. Fins 20 are formedby patterning an etch mask (not shown) over the hard mask 18. The etchmask can include a photoresist or employ other patterning techniques,e.g., spacer image transfer, or the like. A reactive ion etch (RIE) orother etch process is performed to etch the device channel layer 16, thestrain adjustment layer 14 and to etch slightly into the substrate 12.The hard mask 18 can be selectively removed during or after the etchprocess.

In FIG. 4, a dielectric layer 25 can be employed as a shallow trenchisolation region between the fins 20. The dielectric layer 25 can beformed by blanket deposition of a dielectric (e.g., SiOx) everywhere onthe wafer, planarization and recessing the dielectric 25 between thefins 20.

Referring to FIG. 5, dummy gate structures 22 are formed over the fins20. The dummy gate structures 22 include a dummy gate oxide 23, a dummygate 24, a gate cap 26 and a dielectric layer 28. The dummy gate oxide23 can include a thermal or deposited oxide formed on the device channellayer 16. The dummy gate 24 can include polysilicon or amorphoussilicon. The gate cap 26 can include silicon nitride, and the dielectriclayer 28 can include silicon oxide. Other materials and multiple layersmay also be employed. After the deposition of the dummy gate materials,a patterning process is employed to form the gate structures 22 byetching the dummy gate materials. The dummy gate structures 22 areformed perpendicularly to the fins 20.

Referring to FIG. 6, a schematic top view shows section lines forparallel to fins (\\ Fins) and perpendicular to fins (⊥ Fins) are shownfor illustrative purposes. Gate structures 22, 46 are depictedtransversely to the fins 22, 46.

Referring to FIGS. 7 and 8, a conformal spacer layer deposition isperformed followed by a RIE process to form spacers 30. The spacers 30can include silicon nitride or low K materials (e.g., SiBCN, SiOCN,SiON) although other suitable spacer materials can be employed. Usingthe dummy gate structures 22 and spacers 30 as an etch mask, ananisotropic etch process (e.g., RIE) is employed to cut the fins 20. Theetch process etches through the device channel layer 16, the strainadjustment layer 14 and stops within the substrate 12 to ensure that thestrain adjustment layer 14 is completely cut through. The strainadjustment layer 14 then begins to relax in the direction of arrows 32.This begins to induce stress/strain to the device channel layer 16 incontact with the strain adjustment layer 14. The remaining portions ofthe device channel layer 16 form a channel for a finFET device and areunder compressive strain. The use of the compressive strain channelprovides a benefit for p-type FET devices. In FIG. 8, the fin cutremoves portions of the fins 20 down to the substrate and leavestrenches 36 through the dielectric layer 25.

Referring to FIGS. 9 and 10, source/drain (S/D) regions 38 are formed.The S/D regions 38 can be epitaxially grown. In one useful embodiment,the S/D regions 38 can include materials that provide additionalcompressive stress (shown by arrows 35) in the channel region (adjacentlayer 16). In one embodiment, the S/D regions 38 can include, e.g.,boron doped silicon or SiGe:B to provide an additional externalstressor.

Referring to FIGS. 11 and 12, a stacked nanosheet system 40 isillustratively depicted in cross-section in FIG. 11 where thecross-section is taken parallel (\\) to the fins that will be formed.FIG. 12 shows the stacked nanosheet system 40 illustratively depicted incross-section where the cross-section is taken perpendicular (⊥) to thefins that will be formed.

A stacked nanosheet 42 is formed or provided on the strain adjustmentlayer 14, which is formed on the substrate 12. The strain adjustmentlayer 14 is formed on the substrate 12 and includes an “as deposited”material that includes a different out of plane lattice parameter thanthe substrate 12. In particularly useful embodiments, the strainadjustment layer 14 includes a tensile stress/strain to induce acompressive strain in the nanosheet 42, as will be described. However,it should be understood that the present embodiments can apply tocompressive material to induce tensile stress/strain as well.

In one embodiment, the substrate 12 can include a silicon-basedmaterial, and, in particular, monocrystalline silicon (Si). Thesubstrate 12 is not limited to monocrystalline forms of Si as othermaterials and multi-layers thereof may be employed. In one embodiment,the stacked nanosheet 42 can include stacked nanowires instead of asheet.

Strain adjustment layer 14 is preferably formed on the substrate 12 byepitaxial growth. In one embodiment, strain adjustment layer 14 includesSi₃P₄ or SiC. The strain adjustment layer 14 can be formed withoutrelaxation. In one embodiment, the Si₃P₄ can be employed and include athickness of about 50 nm or more while maintaining its tensileproperties. The strain adjustment layer 14 is deposited on the substrate12 with a smaller out of plane lattice parameter to eventually result inthe inducement of a compressive stress/strain in the device channellayer 16. The nanosheet 42 is epitaxially grown and provided on thestrain adjustment layer 14. The nanosheet 42 includes alternating layers16, 17 of monocrystalline materials. Layers 16 can include the samematerial or a different material than the substrate 12. Layers 16 willeventually form a compressed device channel. In one embodiment, thelayers 16 include silicon (Si), silicon germanium (SiGe) or othercrystalline materials. Layers 17 of the nanosheet 42 may include thesame material as the strain adjustment layer 14 (e.g., Si₃P₄, SiC). Ahard mask 18 is formed on the nanosheet 42. The hard mask 18 may includea nitride, such as, e.g., SiN, although other materials or multilayersmay be employed.

Referring to FIGS. 13 and 14, the cross-section of FIG. 13 is takenparallel (\\) to a fin 44, and the cross-section of FIG. 14 is takenperpendicular (⊥) to the fins 44 that will be formed. Fins 44 are formedby patterning an etch mask (not shown) over the hard mask 18. The etchmask can include a photoresist or employ other patterning techniques,e.g., spacer image transfer, or the like. A RIE or other etch process isperformed to etch the nanosheet 42, to etch the strain adjustment layer14 and to etch slightly into the substrate 12. The hard mask 18 can beselectively removed during or after the etch process.

In FIG. 14, a dielectric layer 55 can be employed as a shallow trenchisolation region between the fins 44. The dielectric layer 55 can beformed by blanket deposition of a dielectric (e.g., SiOx) everywhere onthe wafer, planarization and recess between the fins 20.

Referring to FIG. 15, dummy gate structures 46 are formed over the fins44. The dummy gate structures 46 include a dummy gate oxide 23, a dummygate 48, a gate cap 50 and a dielectric layer 52. The dummy gate oxide23 can include a thermal oxide formed on a top most layer of thenanosheet 42. The dummy gate 48 can include polysilicon or amorphoussilicon. The gate cap 50 can include silicon nitride, and the dielectriclayer 52 can include silicon oxide. Other materials and multiple layersmay also be employed. After the deposition of the dummy gate materials,a patterning process is employed to form the gate structures 46 byetching the dummy gate materials. The dummy gate structures 46 areformed perpendicularly to the fins 44.

Referring to FIGS. 16 and 17, a conformal spacer layer deposition isperformed followed by a RIE process to form spacers 56. The spacers 56can include silicon nitride, although other suitable spacer materialscan be employed. Using the dummy gate structures 46 and spacers 56 as anetch mask, an anisotropic etch process (e.g., RIE) is employed to cutthe fins 44. The etch process etches through the nanosheet 42, thestrain adjustment layer 14 and stops within the substrate 12 to ensurethat the strain adjustment layer 14 is completely cut through. Thestrain adjustment layer 14 and layers 17 then begin to relax in thedirection of arrows 58. This begins to induce stress/strain to thelayers 16 in contact with the strain adjustment layer 14 and layers 17.The remaining portions of the layers 16 form a channel for a finFETdevice and are under compressive strain. The use of the compressivestrain channel provides a benefit for p-type FET devices.

In one embodiment, a thin protective liner 54 is deposited in contactwith sidewalls of the fins 44 and over exposed surfaces of the substrate12. The thin protective liner 54 can include a crystalline semiconductormaterial such as, e.g., silicon (Si). The thin protective liner 54 maybe omitted in favor of other protective measures as will be described.The thin protective liner 54 prevents lateral etching into the fins 44during the formation of the nanosheets and final metal gate in thesubsequent steps. In FIG. 17, the fin cut removes portions of the fins44 down to the substrate 12 and leaves trenches 60 through thedielectric layer 55.

Referring to FIGS. 18 and 19, source/drain (S/D) regions 62 are formed.The S/D regions 62 can be epitaxially grown on the substrate 12 and theprotection layer 54. In one useful embodiment, the S/D regions 62 caninclude a material that provides additional compressive stress in thechannel region 16. In one embodiment, the S/D regions 62 can include,e.g., boron doped silicon or SiGe:B to provide an additional externalstressor.

Referring to FIG. 20, in another embodiment, instead of forming the thinprotective liner 54 and before forming S/D regions 62, a selective etchprocess is performed to etchback (recess) lateral portions of the layers17 and layer 14 of the fins 44. The selective etch can include a wet ordry etch. Then, a dielectric material 64 is deposited to provide gateisolation from the S/D regions 62 to be formed by filling in therecessed regions. A RIE or wet etch process is performed to remove theremaining dielectric material 64 and leave behind dielectric material64. The dielectric material 64 prevents lateral etching into the fins 44during the formation of the nanosheets and final metal gate in thesubsequent steps. The dielectric material 64 can include a lowdielectric constant material (e.g., equal to or less than the dielectricconstant of silicon oxide) to provide preferred capacitancecharacteristics between the gate and S/D regions.

Referring to FIG. 21, the S/D regions 62 can be epitaxially grown. Inone useful embodiment, the S/D regions 62 can include a material thatprovides additional compressive stress in the channel region (layers16). In one embodiment, the S/D regions 62 can include, e.g., borondoped silicon or SiGe:B to provide an additional external stressor.

Referring to FIGS. 22 and 23, while the embodiments of either FIG. 18 orFIG. 21 can be employed, additional processing will be described interms of the embodiments of FIG. 21. Such processing is applicable toeither embodiment.

A dielectric fill 66 is deposited over device to fill in spaces betweenthe gate structures 46. The dielectric fill 66 can include a form ofoxide, e.g., a silicon oxide, although any suitable dielectric materialcan be employed. A planarization process, such as, e.g., a chemicalmechanical polish (CMP), is performed to expose the dummy gate 48.

Referring to FIGS. 24 and 25, the dummy gate 48 and the strainadjustment layers 14 and 17 are removed to form a void 70 and exposelayers 16. The layers 16 extend between the S/D regions 62. The layers16 are in effect clamped between the S/D regions 62. There is little orno relaxation of the compressive stress in the channel region (layers16) as the channel region (layers 16) is clamped by the S/D regionepitaxy on both sides.

Referring to FIGS. 26 and 27, the layers 16 form a device channelbetween S/D regions 62. The layers 16 have a gate dielectric (not shown)formed thereon and the voids 70 are filled with a conductive material 72to form a gate electrode. The conductive material 72 can include a metal(e.g., tungsten, titanium, tantalum, ruthenium, zirconium, cobalt,copper, aluminum, lead, platinum, tin, silver, gold), a conductingmetallic compound material (e.g., tantalum nitride, titanium nitride,tungsten silicide, tungsten nitride, ruthenium oxide, cobalt silicide,nickel silicide), carbon nanotube, conductive carbon, graphene, or anysuitable combination of these materials. The conductive material mayfurther comprise dopants that are incorporated during or afterdeposition. Processing continues with the formation of additionalcomponents and structures to complete the device, e.g., contacts, metallines, etc.

Having described preferred embodiments for stress induction in 3D devicechannels using elastic relaxation of high stress material (which areintended to be illustrative and not limiting), it is noted thatmodifications and variations can be made by persons skilled in the artin light of the above teachings. It is therefore to be understood thatchanges may be made in the particular embodiments disclosed which arewithin the scope of the invention as outlined by the appended claims.Having thus described aspects of the invention, with the details andparticularity required by the patent laws, what is claimed and desiredprotected by Letters Patent is set forth in the appended claims.

1. A method for inducing stress in a device channel, comprising: forminga stress adjustment layer, formed from a material including siliconphosphide (Si₃P₄), on a substrate, the stress adjustment layer includingan as deposited stress due to crystal lattice differences with thesubstrate; forming a device channel layer on the stress adjustmentlayer; etching cuts though the device channel layer and the stressadjustment layer to release the stress adjustment layer to induce stressin the device channel layer and form a fin such that the stressadjustment layer extends through the fin from the device channel layerto the substrate; and forming source/drain regions adjacent to thedevice channel layer.
 2. The method as recited in claim 1, wherein thestress adjustment layer includes a tensile stress to form a compressivestress in the device channel layer.
 3. (canceled)
 4. The method asrecited in claim 1, wherein the device channel layer includes a materialselected from the group consisting of silicon (Si) and silicon germanium(SiGe).
 5. The method as recited in claim 1, wherein forming thesource/drain regions adjacent to the device channel layer includesforming stressed source/drain regions to externally provide additionalstress to the device channel layer.
 6. The method as recited in claim 1,wherein the device channel layer includes a fin.
 7. The method asrecited in claim 1, wherein the device channel layer includes layers ina nanosheet.
 8. A method for inducing stress in a device channel,comprising: forming a stress adjustment layer, formed from a materialincluding silicon phosphide (Si₃P₄), on a substrate, the stressadjustment layer including an as deposited stress due to crystal latticedifferences with the substrate; forming a device channel layer on thestress adjustment layer; forming fins in the device channel layer on thestress adjustment layer such that the stress adjustment layer extendsthrough the fin from the device channel layer to the substrate; forminggate structures transversely over the fins; etching cuts though thedevice channel layer and the stress adjustment layer on sides of thegate structures to release the stress adjustment layer to induce stressin the device channel layer; and forming source/drain regions adjacentto the device channel layer.
 9. The method as recited in claim 8,wherein the stress adjustment layer includes a tensile stress to form acompressive stress in the device channel layer.
 10. (canceled)
 11. Themethod as recited in claim 8, wherein the device channel layer includesa material selected from the group consisting of silicon (Si) andsilicon germanium (SiGe).
 12. The method as recited in claim 8, whereinforming the source/drain regions adjacent to the device channel layerincludes forming stressed source/drain regions to externally provideadditional stress to the device channel layer.
 13. The method as recitedin claim 8, wherein the device channel layer includes a multi-layerednanosheet including alternating layers of channel layers and stressadjustment layers.
 14. The method as recited in claim 13, furthercomprising forming a protection layer along sidewalls of the fins beforeforming the source/drain regions.
 15. The method as recited in claim 13,further comprising: recessing the alternating stress adjustment layersand the stress adjustment layer; and depositing a dielectric material inthe recesses to protect sidewalls of the fins before forming thesource/drain regions.
 16. The method as recited in claim 13, furthercomprising: removing the alternating stress adjustment layers and thestress adjustment layer to form a void and to expose the alternatingchannel layers such that the alternating channel layers are clampedbetween the source/drain regions to maintain stress; and forming gatematerial to fill the void.
 17. A semiconductor device having compressivestress in a device channel, comprising: a stress adjustment layer,formed from a material including silicon phosphide (Si₃P₄), formed on asubstrate; a device channel layer formed on the stress adjustment layer,the device channel layer including a compressive stress induced bystress relaxation of the stress adjustment layer, which includes tensilestress from an as deposited stress provided from crystal latticedifferences with the substrate and the stress adjustment layer and thedevice channel layer forming a fin such that the stress adjustment layerextends through the fin from the device channel layer to the substrate;and source/drain regions formed adjacent to the device channel layer.18. The device as recited in claim 17, wherein the device channel layerincludes a material selected from the group consisting of silicon (Si)and silicon germanium (SiGe).
 19. The device as recited in claim 17,wherein the source/drain regions externally provide additional stress tothe device channel layer.
 20. The method as recited in claim 17, whereinthe device channel layer includes a fin or layers in a nanosheet.